PRZOOM - /newswire/ - Plano, TX, United States, 2025/09/25 - Siemens and ASE have collaborated to validate 3Dblox workflows for three VIPack technologies, including Fanout Chip-on-Substrate, (FOCoS), Fanout Chip-on-Substrate-Bridge (FOCoS-Bridge), and Through Silicon Via (TSV)-based 2.5D and 3D IC - ASEGlobal.com.

Siemens Digital Industries Software today announced that it is collaborating with Advanced Semiconductor Engineering, Inc. (ASE), the leading global provider of semiconductor manufacturing services in assembly and test, to develop 3Dblox-based workflows for the ASE VIPack™ platform using Siemens’ Innovator3D IC™ solution, which is fully certified for the 3Dblox standard..

Siemens and ASE have collaborated to validate 3Dblox workflows for three VIPack technologies, including Fanout Chip-on-Substrate, (FOCoS), Fanout Chip-on-Substrate-Bridge (FOCoS-Bridge), and Through Silicon Via (TSV)-based 2.5D and 3D IC.

ASE’s VIPack (aseglobal.com) is comprised of six core packaging technology pillars supported by a comprehensive and integrated co-design ecosystem. As ASE’s advanced packaging platform, it is designed to enable vertically integrated package solutions and represents its next generation of 3D heterogeneous integration architecture that extends design rules and achieves ultra-high density and performance. The platform leverages advanced redistribution layer (RDL) processes, embedded integration, and 2.5D and 3D technologies to help customers achieve unprecedented innovation when integrating multiple chips within a single package.

“Siemens’ Innovator3D IC provides ASE with a rapid design assembly exploration cockpit that can read and write 3Dblox,” said Dr. CP Hung, vice president, Corporate R&D at ASE. “This collaboration allows ASE to optimize efficiency by developing 3Dblox definitions for some of our leading-edge VIPack technologies. It offers our customers EDA tool flexibility to quickly overcome package design challenges and accelerate time-to-market.”

3Dblox and Innovator3D IC enable System Technology Co-optimization (STCO) driven hierarchical device planning that is considered mandatory for chiplet-based heterogeneous integration using advanced packaging technologies such as those across ASE’s VIPack platform.

“Siemens has had a series of beneficial collaborations with ASE, and we are both committed to 3Dblox for semiconductor package design and verification, as it streamlines the design process and delivers open interoperability,” said AJ Incorvaia, senior vice president, Electronic Board Systems, Siemens Digital Industries Software. “As 3Dblox continues to extend we see even greater value and capability that we can deliver to our mutual customers.”

Siemens Digital Industries Software (siemens.com) helps organizations of all sizes digitally transform using software, hardware and services from the Siemens Xcelerator business platform. Siemens' software and the comprehensive digital twin enable companies to optimize their design, engineering and manufacturing processes to turn today's ideas into the sustainable products of the future. From chips to entire systems, from product to process, across all industries. Siemens Digital Industries Software Accelerating transformation.

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Agency / Source: Siemens AG

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