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• Companies to deliver end-to-end system solution that combines Snapdragon Ride Flex SoC with Hyundai Mobis's unified, scalable software platform.
• Domain-consolidated system solution designed to meet the growing demand for powerful compute resources to process sensor data and drive high-fidelity graphics, supporting efficient and reliable performance in modern vehicles.
Through the technology collaboration, the companies will combine Qualcomm Technologies’ Snapdragon Ride™ Flex System-on-Chip (SoC) and Snapdragon Ride™ Automated Driving Stack with Hyundai Mobis’s cutting-edge software and sensors to deliver a comprehensive system solution that powers advanced infotainment and advanced driver assistance systems (ADAS), bringing a one-of-a-kind user experience to future vehicles. This technology alliance merges the high-performance processing capabilities and software framework of the Flex SoC, which supports cockpit, advanced driver assistance systems (ADAS), and automated driving (AD) functionalities on a single chipset, with Hyundai Mobis’s cutting-edge software applications to deliver performance, enhanced safety, and increased efficiency for automakers across the globe.
As the functions and software that are applied to modern vehicles become more complex, central computers are essential for efficiently managing various functions. The Flex SoC is designed to meet this need with the SoC’s ability to handle flexible, mixed-criticality workloads. It supports both safety and non-safety critical applications on a single chip with a solution addressing freedom from interference (FFI) and offers scalability from entry-level to premium tiers. When paired with Hyundai Mobis’s extensive software and solutions, the system supports advanced cockpit features with integrated instrument clusters, driving and parking solutions and ADAS systems that are based on the Snapdragon Ride Automated Driving stack.
“We are thrilled to continue our collaboration with Qualcomm Technologies to develop a comprehensive system solution that delivers efficient compute performance while maintaining the highest standards of safety, security, and reliability,” said Soo Kyung Jung, executive vice president and head of the automotive electronics business unit, Hyundai Mobis. "By integrating Hyundai Mobis' expertise in electronics, chassis, and electrification with Qualcomm Technologies' system solutions, we can set the direction and standards for the development of central vehicle computers, ultimately meeting consumer expectations.”
“Our work with Hyundai Mobis is dedicated to providing integrated automotive solutions that meet and exceed automaker and their customer needs,” said O.H. Kwon, senior vice president and president, Qualcomm APAC. “With the Snapdragon Ride Flex SoC, we are making SDV technology accessible and more cost-effective for automakers to embrace the transition to an integrated, open, and scalable architecture across all their vehicle segments. We look forward to this continued relationship with Hyundai Mobis and look forward to seeing our Ride Flex solution in upcoming global OEMs’ vehicles.”
The Flex SoC is currently available. For more information about the Flex SoC, please click here. For additional information on Mobis software, please log onto here.
About Qualcomm
Qualcomm (qualcomm.com) relentlessly innovates to deliver intelligent computing everywhere, helping the world tackle some of its most important challenges. Our proven solutions drive transformation across major industries, and our Snapdragon® branded platforms power extraordinary consumer experiences. Building on our nearly 40-year leadership in setting industry standards and creating era-defining technology breakthroughs, we deliver leading edge AI, high-performance, low-power computing, and unrivaled connectivity. Together with our ecosystem partners, we enable next-generation digital transformation to enrich lives, improve businesses, and advance societies. At Qualcomm, we are engineering human progress.
Qualcomm Incorporated includes our licensing business, QTL, and the vast majority of our patent portfolio. Qualcomm Technologies, Inc., a subsidiary of Qualcomm Incorporated, operates, along with its subsidiaries, substantially all of our engineering and research and development functions and substantially all of our products and services businesses, including our QCT semiconductor business. Snapdragon and Qualcomm branded products are products of Qualcomm Technologies, Inc. and/or its subsidiaries. Qualcomm patents are licensed by Qualcomm Incorporated.
About Hyundai Mobis
Hyundai Mobis (mobis.com) is the global no. 6 automotive supplier, headquartered in Seoul, Korea. Mobis has outstanding expertise in sensors, sensor fusion in ECUs and software development for safety control. The company's products also include various components for electrification, brakes, chassis and suspension, steering, airbags, lighting, and automotive electronics. Hyundai Mobis operates its R&D headquarters in Korea, with 4 technology centers in the United States, Germany, China and India.
Qualcomm and Snapdragon products mentioned within this press release are offered by Qualcomm Technologies, Inc. and/or its subsidiaries.
Qualcomm and Snapdragon are registered trademarks of Qualcomm Incorporated.
Contact Information: Mauricio Lopez-Hodoyan - Investor Relations
P: 858-658-4813 - E: ir[.]qualcomm.com..
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