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The compact modules support high power at +23dBm (Type 2HK) and low power at +13dBm (Type 2HL) smart IoT applications. They can be used in consumer smart devices, such as connected smart homes and smart accessories, as well as for business and industrial applications, including access control, smart energy solutions, building automation, security cameras, infrastructure management, and medical devices.
“Thanks to Murata’s proprietary high-density packaging technology, the Type 2HK/2HL Wi-Fi HaLow™ modules offer both high power and low power capabilities in a compact, surface mount package,” says Masatomo Hashimoto Director of Communication & Sensor Business Unit, Murata. “By utilizing long-range, high-speed communication for a private network, smart device and smart equipment, manufacturers can change existing Wi-Fi/IP communication solutions to achieve area expansion while reducing radio usage and improving power consumption efficiency, contributing to more sustainable solutions.”
Due to their IP-native standard compliance with no network costs, the Type 2HK/2HL modules reduce the need for repeaters in existing Wi-Fi/IP communication-based solutions, enabling private network area expansion and lowering system costs. Additionally, compared to other low-power, wide-area (LPWA) network technologies, the long-range, high-speed communication of the modules can facilitate image and video transmission. This enhanced communication capability can be used for IoT deployments to inspect and maintain infrastructure and hazardous areas outside of cellular coverage, enabling automation with significant energy and cost savings.
Based on the NRC7394 chipset from NEWRACOM, Inc. with Arm® Cortex® -M3 processor the Type 2HK/2HL modules offer enough processing power to accommodate the Wi-Fi subsystem and user applications. The Type 2HK module operates at frequencies from 902MHz to 928MHz, whereas the Type 2HL is at 750MHz to 950MHz. Both modules feature an SPI host interface with peripherals including SPI, 2x UART, 2x I2C, 2-channel 10-bit ADC and GPIO.
Dr. Sok Kyu Lee, CEO and Chairman of NEWRACOM, explains “the NRC7394 chipset represents the future of Wi-Fi for IoT applications, with low power consumption and extended range capabilities. By integrating our technology into Murata's new module, we are providing a powerful platform for a wide range of industries to implement reliable, efficient wireless communication. We look forward to seeing how this module will help accelerate the adoption of next-generation IoT solutions across the globe."
Housed in a surface-mount LGA package with solder bumps, the modules typically measure 19mm by 13.9mm, have a maximum profile of 2.5mm, and operate in a temperature range from -40°C to +85°C.
Murata will continue to adapt to the latest standards and work on cost reduction, contributing to the further expansion of the IoT market. For more information on the Type 2HK/2HL Wi-Fi HaLow™ module, please visit: LBWA0ZZ2HK and LBWA0ZZ2HL
About Murata
Murata Manufacturing Co., Ltd (murata.com) is a worldwide leader in the design, manufacture and sale of ceramic-based passive electronic components & solutions, communication modules and power supply modules. Murata is committed to the development of advanced electronic materials and leading edge, multi-functional, high-density modules. The company has employees and manufacturing facilities throughout the world.
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