More news: Software
Agency / Source: Siemens AG

Check Ads Availability|e-mail Article

Are you the owner of this article?, Turn it PREMIUM with your LOGO instead - and make it 3rd party Ads-Free! within the next hour!

Siemens Collaborates with Samsung Foundry to Expand 3D-IC Enablement Tools, Optimize Other EDA Solutions for Foundry’s Newest Processes - Samsung also successfully evaluated Siemens’ digitally integrated High Density Advanced Packaging (HDAP) flow for the foundry’s MDI (multi-die-integration) packaging process - Samsung.com / Siemens.com
Siemens Collaborates with Samsung Foundry to Expand 3D-IC Enablement Tools, Optimize Other EDA Solutions for Foundry’s Newest Processes

 

PRZOOM - /newswire/ - Plano, TX, United States, 2024/06/12 - Samsung also successfully evaluated Siemens’ digitally integrated High Density Advanced Packaging (HDAP) flow for the foundry’s MDI (multi-die-integration) packaging process - Samsung.com / Siemens.com.

   
 
Your Banner Ad Here instead - Showing along with ALL Articles covering Software Announcements

Replace these Affiliate Programs at ANYTIME! Your banner here within the next hour. Learn How!


 

Siemens Digital Industries Software today announced that, in collaboration with Samsung Foundry (samsung.com), they have developed compelling new capabilities for the manufacture of multi-die packaged designs at advanced nodes and achieved a host of new product certifications for many of Siemens’ industry-leading IC design and verification technologies.

"Our expanded collaboration with Siemens EDA will help us deliver advanced design enablement solutions that address the evolving needs of our customers," said Sungjae Lee, Vice President and head of Foundry PDK Development Team at Samsung Electronics. "By aligning our roadmaps and optimizing the entire design flow, we can drive advanced packaging innovation across key markets like 5G, automotive, and AI."

Siemens and Samsung: boosting 3D-IC manufacturability

Siemens and Samsung Foundry recently collaborated to update process design kits (PDKs) that seamlessly integrate into Siemens’ Xpedition™ Substrate Integrator (XSI) software and Xpedition™ Package Designer (XPD) software an achievement that allows Samsung to deliver robust PDK updates to mutual customers with minimal disruption to design processes. Siemens’ XSI software empowers engineers to construct a comprehensive digital twin model of an entire multi-die device, enabling seamless design integrations capable of driving all downstream design, analysis, verification, and signoff activities.

Samsung also successfully evaluated Siemens’ digitally integrated High Density Advanced Packaging (HDAP) flow for the foundry’s MDI (multi-die-integration) packaging process. Siemens’ Calibre® xACT™ 3D software and Calibre xL parasitic extraction tools, which quickly and accurately extract register clock parasitics in complex 2.5D and 3D packaging configurations, are now certified for Samsung’s most advanced process nodes, as part of Siemens’ larger Calibre® nmPlatform tool. The parasitic extraction tools within Calibre support signal integrity-aware analysis of entire high bandwidth memory (HBM) channels implemented on 3.5D silicon interposers. Samsung has also qualified decks (4nm technology) for the dies with through silicon vias (TSV) and validated the capability and accuracy of the Calibre parasitic extraction tools for TSV extraction and TSV coupling extraction tasks.

Samsung certifies multiple Siemens EDA product lines and reference flows

Among the many additional recent achievements of the Siemens EDA/Samsung partnership are:

• Siemens’ Calibre nmPlatform software for integrated circuit (IC) verification signoff, which includes Siemens’ new Calibre® DesignEnhancer software, is now fully certified for Samsung Foundry’s latest and greatest process technologies. More specifically, Samsung has qualified Siemens’ Calibre xACT parasitic extraction tool for the foundry’s multi-bridge-channel FET (MBCFET), an optimized version of Gate-All-Around (GAA) transistor technology. Siemens used novel methodologies for the efficient technology description and accurate extraction of parasitics of advanced transistor technologies beyond 3nm.
• Samsung and Siemens have also leveraged AI-powered custom IC verification technologies such as Solido™ Design Environment and Solido Characterization Suite software to enhance variation-aware verification and characterization, as well as Solido™ Crosscheck™ software for comprehensive IP quality assurance.
• Samsung has qualified Siemens’ Analog FastSPICE (AFS) platform for the foundry’s latest processes for SPICE accurate applications. Siemens’ AFS platform is now certified across Samsung Foundry’s FinFET, Extreme UltraViolet (EUV) and GAA fabrication processes (SF4X, SF3P, SF2). AFS is also now qualified for Samsung Foundry’s fully depleted-silicon on insulator (FD-SOI) LN18FDS process technology. With these certifications, mutual customers can now verify their designs using Siemens’ AFS platform with SPICE accuracy and high performance.
• The two organizations have successfully continued their collaboration around open model interface (OMI) development with Si2’s Compact Model Coalition (CMC). OMI, the industry-standard platform for enabling aging modeling and reliability analysis, is now supported by Siemens’ AFS platform across Samsung Foundry’s processes from 14nm to 2nm.
• Samsung has also certified Siemens’ Aprisa™ software for digital implementation for the foundry’s SF3P process node. With this certification, customers using Aprisa for digital implementation tasks can design projects at SF3P with fully certified technology, proven correlation with Siemens’ Calibre sign-off tools and support for all the design rules and features of Samsung Foundry’s advanced GAA process technology platform.
• Further, Samsung and Siemens have created new design implementation solutions that improve power structure robustness and reduce design cycle time. Calibre DesignEnhancer, which is part of Siemens’ Shift Left initiative, takes the foundry’s rules and automatically performs layout optimization tasks that enhance the customer’s design. Calibre DesignEnhancer currently has three use models that use the Calibre platform to deliver DRC clean results, and multiple customers have successfully proven all three Calibre DesignEnhancer use models.
- DE Via, which maximizes via insertion to minimize IR drop,
- DE Pge, which inserts both vias and parallel interconnects that optimize the power structure to achieve EMIR targets, and
- DE Pvr, which can save hours by effectively inserting DCAP and Filler cells that are required to run physical verification.
• From an IC Test perspective, the partners have established a new design methodology reference flow that supports high-quality testing and precise diagnosis for Samsung’s advanced nodes. Built on DFT technology in Siemens’ Tessent™ software featuring Siemens’ Tessent™ TestKompress™ software, CellModelGen and Diagnosis engines, the solution generates comprehensive fault models, enabling physical defect-based Automatic Test Pattern Generation (ATPG) and scan diagnosis. Covering a wide range of defects, including cell-internal bridge, open, transistor, and port defects, as well as critical area-based interconnect bridge and open and inter-cell bridge defects, this advancement addresses zero DPPM and diagnosis challenges for inside cell and interconnects.

"In today's fast-paced IC design and fabrication landscape, synergy between partners is essential to meeting the increasingly challenging and complex requirements of our mutual customers," said Mike Ellow, CEO of Silicon Systems for Siemens Digital Industries Software. "Our collaboration with Samsung Foundry epitomizes this synergy. Together, we're working to deliver the power, performance and area advantages of 3D-IC architectures for our mutual customers. These advances, together with a raft of new Siemens EDA product certifications and novel design innovations, are now available to help our mutual customers differentiate and win in exceedingly competitive global markets.”

Siemens Digital Industries Software (siemens.com) helps organizations of all sizes digitally transform using software, hardware and services from the Siemens Xcelerator business platform. Siemens' software and the comprehensive digital twin enable companies to optimize their design, engineering and manufacturing processes to turn today's ideas into the sustainable products of the future. From chips to entire systems, from product to process, across all industries. Siemens Digital Industries Software Accelerating transformation.

Note: A list of relevant Siemens trademarks can be found here. Other trademarks belong to their respective owners.

 
 
Your Banner Ad Here instead - Showing along with ALL Articles covering Software Announcements

Replace these Affiliate Programs at ANYTIME! Your banner here within the next hour. Learn How!


 

Agency / Source: Siemens AG

 
 

Availability: All Regions (Including Int'l)

 

Traffic Booster: [/] Quick PRZOOM - Press & Newswire Visibility Checker

 

Distribution / Indexing: [+]  / [Company listed above is a registered member of our network. Content made possible by PRZOOM / PRTODAY indexing services]

 
 
# # #
 
Software Warnings - IMPORTANT:
Always be aware/cautious about what you download on your computer/mobile! PURCHASE SOFTWARE related keywords / Banner Ads. Click HERE for details!
.

 
  Your Banner Ad showing on ALL
Software articles,
CATCH Visitors via Your Competitors Announcements!


Siemens Collaborates with Samsung Foundry to Expand 3D-IC Enablement Tools, Optimize Other EDA Solutions for Foundry’s Newest Processes

Company website links NOT available to basic submissions
It is OK to republish and/or LINK any newswire for any legitimate media purpose as long as you name PRZOOM - Press & Newswire and LINK as the source.
 
  For more information, please visit:
Is this your article? Activate ALL web links by Upgrading to Press Release PREMIUM Plan Now!
3D-IC Manufacturability | Siemens Digital Industrie
Contact: Press Office - Siemens.com 
press.software.sisw[.]siemens.com
 
PRZOOM / PRTODAY - Newswire Today disclaims any content contained in this article. If you need/wish to contact the company who published the current release, you will need to contact them - NOT us. Issuers of articles are solely responsible for the accuracy of their content. Our complete disclaimer appears here.
IMPORTANT INFORMATION: Issuance, publication or distribution of this press release in certain jurisdictions could be subject to restrictions. The recipient of this press release is responsible for using this press release and the information herein in accordance with the applicable rules and regulations in the particular jurisdiction. This press release does not constitute an offer or an offering to acquire or subscribe for any Siemens AG securities in any jurisdiction including any other companies listed or named in this release.

Software via RSSAdd NewswireToday - PRZOOM Headline News to FeedBurner
Find who RetweetFollow @NewswireTODAY

Are you the owner of this article?, Turn it PREMIUM with your LOGO instead - and make it 3rd party Ads-Free! within the next hour!


Read Latest Press Releases From Siemens AG / Company Profile


Read Software Most Recent Related Press Releases:

IMS Applauded by Frost & Sullivan for Shaping Safer and Smarter Mobility with its Telematics and Connected Insurance Solutions
Deposco Applauded by Frost & Sullivan for Addressing Specific Customer Pain Points in the Warehouse Management System Market
Witte Automotive Boosts Production Efficiency with Sequencing Solution by Flexis, Part of Blue Yonder
Oracle and Palantir Unlock New Innovation in Cloud and AI to Power Businesses and Governments Around the World
Oracle Announces Exadata Exascale, World’s Only Intelligent Data Architecture for the Cloud
Infor Acquires Acumen and Albanero
Console Connect Recognized with Frost & Sullivan’s 2024 Global Technology Innovation Leadership Award for its Automation and Blockchain Solutions
Motorola Solutions Acquires Noggin, A Global Provider of Critical Event Management Software
Siemens and Intel Foundry Collaborate to Deliver New Tools Certifications and EMIB/3D-IC Innovation
NetSuite Launches Healthcare Solution Designed to Enhance Efficiency and Improve Patient Care

Boost Your Social Network
& Crowdfunding Campaigns


LIFETIME SOCIAL MEDIA WALL
 
NewswireToday Celebrates 10 Years in Business
.



PREMIUM Members


Visit Omnitronics, Inc.

Visit  BizJobs.com

Visit  La Bella Bakery Artisan Bakery Arizona







 
  ©2005-2024 PRZOOM - Limelon Advertising, Co.
Home | About PRZOOM | Advertise/Pricing | Contact | Investors | Privacy/TOS | Sitemap | FRANCAIS
newswire, PR press releases distribution service magazines engine news alert newsroom press room breaking news public relations articles company news alerts newswiredistribution ezine bizentrepreneur biznewstoday digital business report market search pr firms agencies reports distri-bution today investor relation successful internet entrepreneur newswire distribution prtoday.com freenewswiredistribution asianewstoday bizwiretoday USA pr UK today