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• Secure smartcard OS and applets create comprehensive portfolio for electronic ID documents;
• ST will exhibit at Identity Week (identityweek.net), booth 230, to discuss its software platforms and chips for digital identification, June 11-12 2024, RAI Exhibition Centre, Amsterdam.
As eID documents using secure microcontrollers continue gaining importance in the fight against identity fraud, the STeID platform now accelerates the deployment of advanced solutions. Certified to common criteria EAL 6+, the platform comprises a secure operating system, STeID JC Open OS, and a portfolio of proprietary applets.
The STeID JC Open OS is compliant with the Java Card™ 3.0.5 card application framework and the Global Platform® 2.3.1 security and card-management architecture. This Open Platform OS provides all the features needed to host important applications such as machine-readable travel documents (eMRTD) compliant with the International Civil Aviation Organization ICAO 9303 standard. It also supports the electronic driving license standard ISO 18013, and eIDAS QSCD for qualified digital-signature creation devices. It will include Match-on-Card support for secure offline biometric authentication.
STeID Java Card incorporates support for Near Field Communication (NFC) specifications thereby providing a secure framework for creation of digital identity on mobile devices. The platform is used in conjunction with secure ICs such as ST’s ST31 microcontrollers, which are based on the dual-core Arm® SecurCore® SC000™ core with additional hardware security features. These low-power devices contain non-volatile memory, support contactless communication, RF-energy harvesting, and biometry, and are available in smartcard industry chip-module form factors and wafer-level chip-scale packages.
ST eID Java Card will be available from st.com at the end of June 2024.
About STMicroelectronics
At ST (st.com), we are over 50,000 creators and makers of semiconductor technologies mastering the semiconductor supply chain with state-of-the-art manufacturing facilities. An integrated device manufacturer, we work with more than 200,000 customers and thousands of partners to design and build products, solutions, and ecosystems that address their challenges and opportunities, and the need to support a more sustainable world. Our technologies enable smarter mobility, more efficient power and energy management, and the wide-scale deployment of cloud-connected autonomous things. We are committed to achieving our goal to become carbon neutral on scope 1 and 2 and partially scope 3 by 2027.
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