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EVOC Exhibits at Embedded World 2010 in Nuremburg, Germany - EVOC showcased its latest industrial motherboards based on Intel technology, small-sized low-power box PCs, the most cutting-edge notebook computers and other rugged series product
EVOC Exhibits at Embedded World 2010 in Nuremburg, Germany

 

PRZOOM - /newswire/ - Nuremburg, Germany, 2010/03/05 - EVOC showcased its latest industrial motherboards based on Intel technology, small-sized low-power box PCs, the most cutting-edge notebook computers and other rugged series product.

   
 
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The Embedded World was held in Nuremburg, Germany. Taking place in early March each year, the Embedded World remains the world's undisputed biggest get-together for the international embedded community. A great platform for the release of the world's cutting edge technologies and products, the trade fair reflects to a certain degree the trends of embedded industry for the next two years. During the three-day event, around 450 world-renowned manufacturers coming from over 30 countries gathered here to exhibit their latest or soon-to-released technologies and products. Among them were Intel, Microsoft, Siemens, ABB, Fuji, Panasonic and EVOC. As a regular exhibitor for this annual event in the embedded and industrial PC industry, EVOC garnered considerable visitor attention by showcasing its latest industrial motherboards based on Intel technology, small-sized low-power box PCs, the most cutting-edge notebook computers and other rugged series product.

JNB-1404
Full Rugged and EMC/EMI Compliant Laptop
JNB-1404 possesses wide temperature range, waterproof and dustproof capabilities, salt fog resistance, anti-vibration and anti-drop performance, portability, ruggedness, powerful mobile computing capability, adaptability to harsh environments, high reliability and stability.
Anti-shock & Anti-vibration: MIL-STD-810F
Processor & Chipset: Intel® Core™ 2 Duo + Intel® GME965 + ICH8-M; Intel® L7500/1.6GHz/800MHz
Memory: Onboard 512MB + 1 x SODIMM, supporting 2GB + 512MB DDR2 667
Ethernet & I/O Interface: Supports 1 x 1000Mbps, 3 x USB2.0, 2 x RS232/485, 1 x PCMCIA Type
Operating Temperature: -20℃~+55℃
Relative Humidity: 40℃, 5%-95%
IP Level: IP54
EMC/EMI: MIL-STD-461E

ETX-1813CLNA
Low Power ETX 3.0 Modular Computer with Intel® Latest Embedded Platform
An ETX3.02 compliant embedded computer, ETX-1813CLNA contains onboard Intel® latest Atom™ platform, ultra low power Pineview M processor, onboard 1GB DDR2 memory and abundant I/O ports. As an embedded system which supports secondary development and customization, ETX-1813CLNA can be used for a wide range of embedded applications in electric power, transportation, medical care, aviation and aerospace, etc.
TDP: 13.514watt
Dimensions: 114mm x 95mm
Processor & Chipset: Intel® Pineview M 1.66GHz + Intel® ICH8M
Memory: Onboard 1GB Memory
Ethernet & I/O Interface: Onboard 1 x 100Mbps, 4 x USB2.0, 1 x RS232, 1 x RS232/422/485
Operating Temperature: -40℃~+85℃
Relative Humidity: 40℃, 5%-95%
Linux: Kernel 2.6.28

COM-1814CLNAR
Low Power COM-Express Modular Computer with Intel® Latest Embedded Platform
COM-1814CLNAR is a COM-Express standard motherboard based on PCI Express, SATA, USB2.0, LVDS, SDVO and other differential display technologies. COM-1814CLNAR also supports traditional PCI bus. Its modular design facilitates users’ second development and product upgrade. COM-1814CLNAR contains Core™ 2 Duo processor and DDR3 dual-channel memory, which improves the processing capability of the embedded computing modules. This product can be widely used in electric power, medical care, automatic control, aviation & aerospace, and some other fields.
TDP: 11.38watt
Dimensions: 125mm x 95mm
Processor & Chipset: Intel® Core™ 2 Duo T9400 + Intel® GM45 + ICH9M
Memory: 2 x SODIMM, supporting DDR3 800/1066 up to 8GB
Ethernet & I/O Interface: Onboard 1 x 1000Mbps, 8 x USB2.0, 3 x RS232, 1 x RS232/422/485
Operating Temperature: 0℃~+60℃
Relative Humidity: 40℃, 5%-95%
Linux: Kernel 2.6.23

MEC-5004
Compact Fanless Embedded Box PC with Low Power Core™ 2 Duo Platform
MEC-5004 is a fanless embedded box PC based on dual-Core™ low power Core™ 2 Duo. Shaped with al-alloy, its chassis features excellent sealing, dustproof, heat dispersion and anti-vibration capabilities. Its motherboard contains Intel® Core™ 2 Duo U7500 and DDR2 memory, supports VGA and DVI independent dual display. The product can be widely used for in-vehicle navigation system, intelligent traffic, digital video monitoring and many other applications.
Anti-Shock: 10g/11ms
Anti-Vibration: 5-19Hz/1.2mm; 19-200Hz/1.2g
Dimensions: 265mm x 240mm x 100mm
Processor & Chipset: Intel® Core™ 2 Duo U7500 + Intel® GME965 + ICH8M
Memory: 1 x SODIMM, supports DDR2 400/533/667 up to 2GB
Ethernet & I/O Interface: Supports 2 x 1000Mbps, 6 x USB2.0, 5 x RS232, 7 x RS232/422/485
Operating Temperature: -10℃~+55℃
Relative Humidity: 40℃, 5%-95%
Expansion: 1 x PCI, 1 x PCI-E x4

 
 
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EVOC Exhibits at Embedded World 2010 in Nuremburg, Germany

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Contact: Rebecca Choi - EVOC.com 
+86 755-86255066 rebecca[.]evoc.com
 
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IMPORTANT INFORMATION: Issuance, publication or distribution of this press release in certain jurisdictions could be subject to restrictions. The recipient of this press release is responsible for using this press release and the information herein in accordance with the applicable rules and regulations in the particular jurisdiction. This press release does not constitute an offer or an offering to acquire or subscribe for any EVOC Group securities in any jurisdiction including any other companies listed or named in this release.

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