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Palo Alto, CA, United States, 2006/06/22 - Higher speed requirements for wireless broadband connectivity, voice over internet protocol (VoIP), video-over-IP and other broadband signals will drive the market need for faster and more dense telecom equipment switches, routers..
Higher speed requirements for wireless broadband connectivity, voice over internet protocol (VoIP), video-over-IP and other broadband signals will drive the market need for faster and more dense telecom equipment switches, routers and the associated advanced connector technology. This will be closely followed by the need for more massive requirements in the data storage server market. The incessant need for storage will additionally require more advanced connector solutions to meet this demand.
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While the microelectronics industry is moving toward sub-100 nm designs, the nanometer era is likely to drive novel interconnection innovations that are compliant with low-k-dielectrics. Interconnect innovations supporting low-k-dielectric silicon is likely to occur with the introduction of 45 nm process technology and is likely to get commercialized in another three to four years from now.
“Substantial amounts of investment and effort were being poured into R&D of optoelectronics technology for short range interconnections (for example, less than 1 m) over the last several years,” says Frost & Sullivan Technical Insights Industry Analyst Sivakumar Muthuramalingam. “Many companies globally are investigating the development of affordable metal-based interconnect solutions that will meet performance requirements and foreseeable needs of electronic interconnections over those same distances.”
Researchers globally are also investigating the possibility of integrating flip chip and wire bond die in a single package. The research focus is likely to soon shift toward high volume assembly.
While optical interconnect technology has many inherent benefits attached to it, manufacturers can't use this approach because of the simple reason that semiconductor chips function electrically.
“Optical interconnect technology requires a conversion mechanism to convert E-O-E that necessitates the need for optoelectronic devices such as photo detectors, electrically driven lasers and optoelectronic modulators,” says Muthuramalingam. “Researchers globally are working to address the E-O-E conversion challenge. “
The researchers have sought to address some of the inherent issues associated with optical interconnect technology by building most of the device components on a standard CMOS process. Further global research to address this issue had enabled a promising foundation for chip-to-chip interconnects for the next decade.
Emerging Technology Developments in Chip/Board Level Interconnects, a part of the Semiconductor (IRG 26) subscription, provides an overview and outlook for the market. This study has been segmented into Executive Summary, Technology and Applications Viewpoint (Chip level/Board level interconnects), Technology Adoption Factor Analysis and Assessment of Global Innovation and Opportunities. This research includes detailed emerging technology opportunities and industry trends that have been evaluated following extensive interviews with market participants. Interviews are available to the press.
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Emerging Technology Developments in Chip/Board Level Interconnects