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Themis Announces its New CoolShell Bladed Servers - Themis’ innovative CoolShell Technology is implemented in compact blade servers for use in demanding, mission-critical systems
Themis Announces its New CoolShell Bladed Servers


PRZOOM - /newswire/ - Fremont, CA, United States, 2009/11/19 - Themis’ innovative CoolShell Technology is implemented in compact blade servers for use in demanding, mission-critical systems.

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Themis Computer® announces availability of its innovative CoolShell™ Server Technology, which packages high performance, multi-core processor-based server motherboards with high-end, Graphics Processing Units (GPU), and industry leading network connectivity in a bladed server configuration. Themis’ new blades use CoolShell technology to achieve high server efficiency and lower Total Cost of Ownership (TCO). The use of commercial “server” motherboards provides users the most cost-effective, high compute density blade solutions available. Themis’ CoolShell blade systems are targeted for applications that need a compact, lightweight solution that must operate in demanding environments.

The principle barrier to higher compute density in modular electronic packaging, is the cooling and mechanical stabilization of high dissipation devices, most notably, the new breed of multi-core microprocessors and high performance Graphics Processing Units. Themis’ CoolShell Technology provides a thermal and kinetic management system that is stable and stiff, with a conduction cooled Processor Module “shell”, complete with external air flow paths, heat exchangers and impeller assembly – combined in a single, field replaceable unit (FRU).

Themis’ CoolShell Bladed Servers combine unprecedented network connectivity with up to eight optical/copper ports and a simplified cabling system for easy installation and maintenance. Low TCO is assured by modular, front panel only access for all active components. Network and IO security is assured through the use of independent controller channels, including both Copper and Fiber Gigabit Ethernet NIC’s. Themis’ CoolShell Technology provides kinetic management and thermal headroom to accommodate aggressive scaling of commercial microprocessor and GPU core density, speed and power.

“Working closely with our partners and customers, we design and build rugged computing solutions that assure users of high performance and reliability, even when deployed in hostile operating environments,” said William Kehret, CEO of Themis Computer. “Our new CoolShell Technology is the basis for the next generation of commercial blade servers, providing industry leading compute density, superior scalability, and lower total cost of ownership. We’re seeing broad market acceptance of this new technology and we expect to see CoolShell blade servers systems deployed in a wide range of demanding environments”, Mr. Kehret added.

Themis’ CoolShell CS-3U System
The CoolShell CS-3U is a modularly maintainable, commercial blade server system that packs an extended complement of processing, memory and IO, into a compact 3U, 17.75 inch deep rackmountable CoolShell Subrack. All modules are replaceable from the front, increasing uptime and significantly reducing maintenance costs. All cable connections are on the FRU front panels, so no rear access is required. The CoolShell CS-3U includes five replaceable modules; a dual socket processor blade, an I/O module that accommodates up to three double high PCI-Express controller cards, media plus NIC module and two power supply modules. The CoolShell CS-3U fits in a standard 19” rack.

Key CoolShell CS-3U features and specifications:
• One or two Intel® Quad-Core Xeon® 5440 series CPUs
• Up to 64GB memory
• Three high performance dual headed Graphical Processing Units
• Up 1TB HDD (SATA drive) in Media Module and five additional 2.5 inch SSD/HDDs in optional storage expansion
• Eight copper Gigabit Ethernet ports (RJ45) — seven of which can be configured using optical-fiber ports (SFP) instead of copper
• Environmentally robust
– withstands up to 30G, 25 ms shock and 1G rms vibration (10-2000 Hz)
– meets MIL 901d, 810 and 167
– operates at up to 50°C temperature
– CPU electronics protected from dust and dirt
– light-weight construction
– reduced electromagnetic radiation emission

• Linux®, Microsoft® Windows®, and Solaris™ X86 operating system support.

The CoolShell CS-3U processor Blade is based on an industry standard, off-the-shelf motherboard. It includes two quad-core Intel Xeon processors with up to 64GB of memory, two audio ports and an external PCI-Express expansion port, accessible from the front panel. The CoolShell CS-3U can be quickly updated to the latest processor technology since it is based on off the shelf components. New CoolShell CS-3U processor blades can be available shortly after the latest technology commercial motherboards are brought to market and can easily be upgraded to the latest technology with plug and play FRU technology. Since all FRU’s contain their own cooling path and impellers, higher power upgrades can be accommodated, without rebalancing chassis air flow.

The primary features and benefits of Themis’ CoolShell blade servers for users include:

High Compute Density 1RU Sized Blade Servers – enhances SWaP and increases reliability in extended-environment operations.

Modular Maintainability – provides greater flexibility for system refresh, on synchronous (e.g., cyclical basis) or asynchronous (e.g., as required) schedules. Each module, or FRU, can be refreshed independent of any other module in the system, reducing the cost of service and upgrades, and providing for lower TCO.

Mechanical Integrity - Designed to withstand 30G, 25ms shock events and vibration in excess of 1G rms.

Standard-Form Factor - CoolShell blades are 1RU high and blind-mate connect into blade subracks that conform with 19” RETMA rack standards. CoolShell blades based on new processors are backward compatible with earlier subracks and CoolShell blades.

Shallow-Depth and Reduced Acoustic and Electromagnetic Noise - CoolShell blade’s integrated impeller assembly enable a 17” inch blade depth and a shallow, 17.75” chassis depth, with significantly lower noise than comparable rackmount chassis and blade servers.

Composability – CS-3U modules can be configured, and statically re-configured, depending upon the nature of its deployment. In addition, Themis’ innovative CoolShell System can accept an alternate 1RU I/O Blade module, that can be configured with up to 5TB of RAID Storage, a combination of RAID and Graphics, or a suite of high performance graphics accelerators for use as general purpose numeric array processing engines.

Themis CoolShell CS-3U Availability

The CoolShell CS-3U is available now for evaluation, please contact the factory for more information.

About Themis Computer
Themis Computer ( is a leading developer and supplier of high performance board and system level products for mission-critical telecommunications, military/aerospace, and industrial embedded applications. Themis provides open standards-based embedded computing platforms that support the Solaris™, Linux®, and Windows® operating systems. Themis' products incorporate features designed to ensure high reliability and availability while reducing the risks of failure caused by extreme environments. An ISO 9001 certified company, Themis Computer practices Total Quality Management (TQM) in all areas of its business, from engineering and manufacturing to customer service. Themis Computer is headquartered in Fremont, California and offers worldwide service and support. For more product photos or more information please visit our website or email info[.]

Themis, the Themis logo, and CoolShell are trademarks or registered trademarks of Themis Computer. All other trademarks and registered trademarks are the property of their respective owners.

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Themis Announces its New CoolShell Bladed Servers

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CoolShell CS-3U PR |
Contact: William Hansen - 
510-252-0870 bill.hansen[.]
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IMPORTANT INFORMATION: Issuance, publication or distribution of this press release in certain jurisdictions could be subject to restrictions. The recipient of this press release is responsible for using this press release and the information herein in accordance with the applicable rules and regulations in the particular jurisdiction. This press release does not constitute an offer or an offering to acquire or subscribe for any Themis Computer securities in any jurisdiction including any other companies listed or named in this release.

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