Free press releases distribution network?

Agency / Source: The Simon Group, Inc.

Check Ads Availability|e-mail Article


Are you the owner of this article?, Turn it PREMIUM with your LOGO instead - and make it 3rd party Ads-Free! within the next hour!



Aries’ Pitch Bump Adapters Adapt BGA Devices to 0.40 mm Pitch Boards - Aries Electronics, an international manufacturer of standard, programmed and custom interconnection products, has expanded the line of Fine Pitch Bump Adapters to include adapters that accommodate boards with pitches down
Aries’ Pitch Bump Adapters Adapt BGA Devices to 0.40 mm Pitch Boards

 

PRZOOM - /newswire/ - Sellersville, PA, United States, 2009/11/10 - Aries Electronics, an international manufacturer of standard, programmed and custom interconnection products, has expanded the line of Fine Pitch Bump Adapters to include adapters that accommodate boards with pitches down.

   
 
Your Banner Ad Here instead - Showing along with ALL Articles covering Computer Hardware/Storage Announcements

Replace these Affiliate Programs at ANYTIME! Your banner here within the next hour. Learn How!


 

Aries Electronics, an international manufacturer of standard, programmed and custom interconnection products, has expanded the line of Fine Pitch Bump Adapters to include adapters that accommodate boards with pitches down to 0.40 mm. As part of the Correct-A-Chip series, the new Fine Pitch Bump Adapters allow customers to use higher pitch devices on smaller pitch boards.

The adapter tops have landing pads that can be designed to accept any device on any pitch and easily settle into fine pitch footprints including Thin-Shrink Small Outline Packages (TSSOP) and Quad Flat Packages (QFP) with pitches down to 0.40 mm. In addition, the adapter bottom has raised connection pads up to 0.010" (0.25 mm) that provide easy mounting of the adapter to the target board.

Due to the open space now available on the top of the adapter board, manufacturers can easily add components to the design at a minimal cost. Fine Pitch Bump Adapters save users money by integrating higher pitch BGA devices with boards laid out with smaller pitches that typically could not be used together.

Fine Pitch Bump Adapter boards are 0.032" (0.813 mm) thick FR4 or Rogers 370 HR, with 1/2 oz. copper traces on both sides. The non-solder mask defined (NSMD) pads are finished with electroless nickel immersion gold (ENIG). The apparatus can operate up to 221°F (105°C) for FR4 and 266°F (130°C) for lead-free.

The new adapters are available in tape and reel for high speed SMT assembly and can be manufactured for RoHS compliance. Standard line and trace spacing down to 0.003" (0.076 mm) can be used.

Fine Pitch Bump Adapters are available in panelized form, as an adapter only, or as a turn-key solution with devices mounted. Aries specializes in custom design and production. In addition to standard products, special materials, platings, sizes and configurations can be furnished depending on quantity. For more information regarding an adapter to meet your needs, consult the Aries factory.

Pricing for the Fine Pitch Bump Adapters for a typical application starts at $15 per adapter in quantities of 100. Delivery is 3-4 weeks ARO.

Headquartered in Bristol, Pa., Aries Electronics Inc. (arieselec.com) , manufactures an extremely broad range of custom and standard interconnection and packaging products for electronics. Industry leading products include Zero Insertion Force (ZIF) test sockets for DIP, PGA, PLCC and SOIC devices; the Correct-A-Chip™ product line of "intelligent connectors"; adapters and connectors; several patented concepts for BGA (ball grid array) and LGA (land grid array) sockets; and an extensive array of high frequency test and burn in sockets. The company also specializes in meeting custom requirements for its customers.

 
 
Your Banner Ad Here instead - Showing along with ALL Articles covering Computer Hardware/Storage Announcements

Replace these Affiliate Programs at ANYTIME! Your banner here within the next hour. Learn How!


 

Agency / Source: The Simon Group, Inc.

 
 

Availability: All Regions (Including Int'l)

 

Traffic Booster: [/] Quick PRZOOM - Press & Newswire Visibility Checker

 

Distribution / Indexing: [+]

 
 
# # #
 
 
  Your Banner Ad showing on ALL
Computer Hardware/Storage articles,
CATCH Visitors via Your Competitors Announcements!


Aries’ Pitch Bump Adapters Adapt BGA Devices to 0.40 mm Pitch Boards

Company website links NOT available to basic submissions
It is OK to republish and/or LINK any newswire for any legitimate media purpose as long as you name PRZOOM - Press & Newswire and LINK as the source.
 
  For more information, please visit:
Is this your article? Activate ALL web links by Upgrading to Press Release PREMIUM Plan Now!
|
Contact: Beth Smith 
215-453-8700
 
PRZOOM / PRTODAY - Newswire Today disclaims any content contained in this article. If you need/wish to contact the company who published the current release, you will need to contact them - NOT us. Issuers of articles are solely responsible for the accuracy of their content. Our complete disclaimer appears here.
IMPORTANT INFORMATION: Issuance, publication or distribution of this press release in certain jurisdictions could be subject to restrictions. The recipient of this press release is responsible for using this press release and the information herein in accordance with the applicable rules and regulations in the particular jurisdiction. This press release does not constitute an offer or an offering to acquire or subscribe for any The Simon Group, Inc. securities in any jurisdiction including any other companies listed or named in this release.

Computer Hardware/Storage via RSSAdd NewswireToday - PRZOOM Headline News to FeedBurner
Find who RetweetFollow @NewswireTODAY



Are you the owner of this article?, Turn it PREMIUM with your LOGO instead - and make it 3rd party Ads-Free! within the next hour!




Read Latest Press Releases From The Simon Group, Inc. / Company Profile


Read Computer Hardware/Storage Most Recent Related Press Releases:

KorenixSky--11 Korenix Launches JetNet 6828Gf for Substation Applications
Korenix Launches JetNet 6828Gf for Substation Applications
MXstudio Network Management Suite Features New Functions to Manage the Security Status of Network Devices
Curtiss-Wright’s New Memory-Maximized 16-Core Intel® Xeon® Processor D-based DSP Module is First to Support Up to 128 GB DDR-4 Memory
Moxa Launches MC-1100 Computer Designed for Industrial Automation Applications
Eurotech Announces EDCK 4001 - A New Development Kit to Create IoT Applications from Field-to-Cloud in Minutes
Korenix Introduces Modern Train Solution - Korenix JetNet 7714G-M12
Eurotech Collaborates with Red Hat on the First Code Contribution to and the Availability of Eclipse Kapua
Korenix Launches Industrial Communication Computer - JetBox8312 for High Flexibility Deployment
Moxa Releases New Switch Firmware to Ramp Up Device Security

Boost Your Social Network
& Crowdfunding Campaigns


LIFETIME SOCIAL MEDIA WALL
 
NewswireToday Celebrates 10 Years in Business
Find business coaching, life coaching, executive coaching and corporate coaching, best selling coaching books, ...



PREMIUM Members


Visit  Triggr & Bloom

Visit  NAKIVO, Inc.

Visit  BizJobs.com







 
  ©2016 PRZOOM — Limelon Advertising, Co.
Home | About PRZOOM | Advertise/Pricing | Contact | Investors | Privacy/TOS | Sitemap | FRANCAIS
newswire, PR free press releases distribution service magazines engine news alert newsroom press room breaking news public relations articles company news alerts newswiredistribution ezine bizentrepreneur biznewstoday digital business report market search pr firms agencies reports distri-bution today investor relation successful internet entrepreneur newswire distribution prtoday.com freenewswiredistribution asianewstoday bizwiretoday USA pr UK today