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Epoxies, Etc Introduces New User Friendly Epoxy Potting Compound for Electronic Assemblies - Electronic Design and Manufacturing Engineers will appreciate this easy to use Potting and Encapsulating Compound
Epoxies, Etc Introduces New User Friendly Epoxy Potting Compound for Electronic Assemblies

 

PRZOOM - /newswire/ - Cranston, RI, United States, 2009/06/02 - Electronic Design and Manufacturing Engineers will appreciate this easy to use Potting and Encapsulating Compound.

   
 
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The 20-3001 has a one to one mix ratio, is thin, and does not contain fillers.

The chemists at Epoxies, Etc... formulated an easy to use epoxy potting and encapsulating compound for use in electronic devices and assemblies. Potting and encapsulating compounds are utilized to provide electrical insulation and protection from the environment. Most commercially available compounds are difficult to work with due to three major issues:

• Wide weight mix ratios;
• High viscosity resins that are slow to flow around components;
• Heavily filled resins that are difficult to use in meter mix equipment.

The convenient one to one by volume mix ratio may be the biggest benefit to using the 20-3001 epoxy potting compound. Many of the commercially available potting compounds have difficult user mix ratios. They require an accurate scale to proportion the resin and hardener. Operator errors are common with some of these wide mix ratios. Operators find it easier to volumetrically proportion out equal parts of the 20-3001 resin and hardener.

The 20-3001 is only 1,000 cps in viscosity. Having such a thin compound allows for fast self leveling in and around heavily populated printed circuit boards. Having such a low viscosity also allows for efficient release of air bubbles from the poured material. 20-3001 cures to a smooth glass like finish.

The chemists also formulated this product without the use of fillers. Fillers present two problems for the potting operation. The first concern is the settling of the fillers during storage and therefore requires a necessary step of pre-mixing prior to use. The second issue is with the purchase and use of Meter Mix and Dispense Equipment. Dispensing equipment becomes more complicated and expensive when the product being dispensed contains fillers. Less expensive dispensing equipment can be utilized with the 20-3001 epoxy potting compound.

Samples of the 20-3001 are available upon request through our web site. In addition to standard bulk packaging the product is also packaged in the convenient TriggerBond dual barrel cartridge system.

Epoxies, Etc... (epoxies.com) is a formulator of epoxy, urethane, and silicone formulations. Its adhesives, potting compounds, and coatings are widely used in the electronic, aerospace, and, medical device industries. Technical Service Engineers are available to provide technical assistance. A Product Selection Form can be completed on the website or simply call 800-Epoxies (376-9437) for assistance.

 
 
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Epoxies, Etc Introduces New User Friendly Epoxy Potting Compound for Electronic Assemblies

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Contact: Michael Harrington - Epoxies.com 
401-946-5564 sales[.]epoxies.com
 
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IMPORTANT INFORMATION: Issuance, publication or distribution of this press release in certain jurisdictions could be subject to restrictions. The recipient of this press release is responsible for using this press release and the information herein in accordance with the applicable rules and regulations in the particular jurisdiction. This press release does not constitute an offer or an offering to acquire or subscribe for any Epoxies, Etc... securities in any jurisdiction including any other companies listed or named in this release.

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