PRZOOM - /newswire/ -
San Jose, CA, United States, 2009/01/05 - Hesse & Knipps, leading manufacturer of high-speed, fine pitch wedge bonders for the back-end semiconductor industry, will partner with MEW Consulting, recently founded by Michael Whitehead, to provide technical support for third-party wedge and wire.
Through the partnership, Hesse & Knipps and MEW Consulting will provide various support services including:
• High level technical and process/applications support;
• Wire/wedge bonding equipment repairs;
• Automatic wedge bonder rentals that protect against extended machine down-time situations;
• Training programs;
• Maintenance programs.
As a value-added service to customers, Hesse & Knipps will accept legacy equipment as trade-ins for new
Hesse & Knipps bonding equipment purchases. Additionally, Hesse & Knipps will offer leasing packages that can protect a customer against losses due to extended machine down situations.
“In addition to legacy wedge bonding equipment, we have made a commitment to support legacy die bonding equipment through a recent partnership formed with CMTec AG," notes Joseph Bubel, President, Hesse & Knipps. “It is our firm belief that strong technical support capabilities, complemented by our technological leadership in areas such as Process Integrated Quality Control, will be key in supporting the current and future requirements of our customers and the market. We also remain committed to the design and development of new semiconductor technology to support the future needs of our customers and the market.”
About MEW (Microelectronic Wire Bonding) Consulting
A well-known wire bonder expert with nearly 30 years of experience in the back-end semiconductor equipment industry, Michael Whitehead established MEW Consulting to provide process development, equipment repair and other technical assistance on legacy semiconductor equipment being phased out by original manufacturers. The company’s range of technical expertise extends to automatic and manual wire/wedge bonders, ball bonders, die attach and saw platforms.
About Hesse & Knipps
Hesse & Knipps GmbH Semiconductor Equipment (hesse-knipps.us), a privately held worldwide company based in Paderborn, Germany, is a leading designer and manufacturer of high speed fine pitch wedge bonders, heavy wire bonders and complementary equipment for semiconductor backend assembly. The company’s automatic wedge bonders handle aluminum and gold wire in round and ribbon wire configurations with solutions for both light and heavy wire applications ranging from 12.5 micron (.0005) to 500 microns (.020) wire diameters. The company’s product line also includes dispensers and ultrasonic flip chip bonders, standard or customized indexers and handling systems, and process and manufacturing monitoring systems for interfacing with the company’s equipment and commercial software packages.