With several non-card forms such as the universal serial bus (USB) and the mobile near field communication (NFC) showing enormous potential for smart card application, the implementation of smart card integrated circuits is no longer restricted to standard plastic card forms.
New analysis from Frost & Sullivan (smartcards.frost.com), Smart Card IC Form Factor in Asia Pacific, finds that non-card form factors for smart card integrated circuit technology in Asia Pacific remains a small portion of smart cards shipped today. However, this number is expected to increase as the users show greater acceptance of alternative forms, in particular the USB and mobile handset forms.
“The Far East region has already made rapid strides in the area of NFC mobile handsets, while smart card manufacturing giants have drawn up plans to launch smart card USB devices,” says Frost & Sullivan Research Associate Reuben Foong. “Other forms are gradually picking up steam and may become prevalent in the near future, while some form factors have emerged as ideal solutions in certain niche markets.”
This rapid deployment has been driven by many interesting developments in technology, market growth, and end-user acceptance.
However, market penetration is not likely to be easily achieved since entrants will have to deal with several challenges such as cost, culture, and infrastructure. While some countries are prepared to tackle these issues and initiate implementations, some others may take a lot longer, especially since new technology typically takes time to gain widespread adoption.
In such a scenario, market pioneers will gain the most with their first-mover advantage. Companies should recognize and accept the need to create strategic alliances and partnerships to gain easier entry to the market, cater to underserved markets, and optimally penetrate current ones.
Having gained a foothold in a market, market participants must turn their attention to how best to serve it.
“The ever present need for integration of the different uses of smart cards coupled with the potential that smart cards hold is creating a need to leverage this technology,” notes Foong. “By combining existing technology to tap into the security, capacity, and versatility of smart cards, certain form factors may well help utilize dormant features in the standard plastic card.”
If you are interested in a virtual brochure, which provides manufacturers, end users, and other industry participants with an overview of the smart card IC form factor in Asia Pacific, then send an email to Donna Jeremiah, Corporate Communications, at djeremiah[.]frost.com, with your full name, company name, title, telephone number, company email address, company website, city, state and country. Upon receipt of the above information, an overview will be sent to you by email.
Smart Card IC Form Factor in Asia Pacific is part of the Smart Cards Growth Partnership Service program, which also includes research in the following markets: Asia Pacific smart card management systems, Asia Pacific e-passport market, Asia Pacific contactless market. All research services included in subscriptions provide detailed market opportunities and industry trends that have been evaluated following extensive interviews with market participants. Interviews with the press are available.
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Smart Card IC Form Factor in Asia Pacific