New analysis from Frost & Sullivan (technicalinsights.frost.com), Global Trends in Electronic/Chip Packaging, finds that 3D packaging technology will be key in catering to the ever-increasing miniaturization demands from application sectors that include consumer electronics, game consoles, and a wide range of high-speed memory devices. Looking beyond successful solutions such as system on chip (SoC), the electronic/chip packaging industry has steadily started exploring various forms of system in package (SiP)-based solutions.
Currently, the industry focuses on interconnect technologies, signal integrity issues, and manufacturing capabilities. Resolving all challenges with regards to 3D system design remains very important to drive this technology efficiently across the supply chain.
"Advances in the field of packaging technologies are taking the package closer to the bottom-line wafer," notes Frost & Sullivan Technical Insights Research Analyst Krishnakumar Srinivasan. "A close look into the latest packaging solutions such as 3D packaging will show that packaging technologies have advanced to such an extent that they share a dominant role in maintaining advances in the semiconductor industry along the Moore curve."
The demands of the consumer electronics industry remains the most influential driver for technological advances in the semiconductor industry. Moore's curve identifies growth patterns in the electronics industry and any indication that further development along this curve would be difficult, but would spur innovation in the industry. Electronic packaging increasingly supports miniaturization. All along the growth curve of packaging technologies, the packaging module has subtly moved a step closer to the wafer. With advances in technologies such as SiP, SoC, and Wafer Level Packaging (WLP), the package and wafer have become merged entities of an integrated chip.
However, there remain a few critical challenges that restrain the pace of development efforts around the globe. The industry needs to focus on the development of efficient design tools for 3D system design. Advances in interconnect technologies, bonding technologies, and manufacturing equipment remain key areas that require development focus in this demanding space.
"Thinking in 3D is the most critical aspect of the evolution of 3D packaging solutions," says Srinivasan. "While there are some demonstrations around the globe in 3D packages, most of these efforts are restrained due to the lack of proper 3D design tools."
Despite all this, developers of advanced packaging technologies are successfully taking the technology forward. The most successful efforts result from the establishment of very clear in-house rules and standards that guide development. Beyond this, most developers understand the need to address manufacturing and deployment issues at an early stage of development.
A proper level of knowledge sharing through consortiums, for example, will enable the establishment of successful standards for contribution across the entire supply chain. Such efforts will highlight the technology needs to be addressed at each stage of the supply chain and accelerate the evolution of advanced packaging technologies.
Global Trends in Electronic/Chip Packaging, a part of the Technical Insights program, provides a technology overview and outlook for electronic/chip packaging. The study covers some of the latest trends in emerging packaging technologies with a focus on 3D Packaging. Furthermore, this research service includes detailed technology analysis and industry trends evaluated following extensive interviews with market participants. Interviews with the press are available.
If you are interested in an analysis, which provides manufacturers, end users, and other industry participants with an overview, summary, challenges, and latest coverage of global trends in Electronic/Chip Packaging, send an email to David Escalante, Corporate Communications, at descalante_ti[.]frost.com with your full name, company name, title, telephone number, company email address, company website, city, state and country. Upon receipt of the above information, an overview will be sent to you by email.
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