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OnChip Introduces Miniature EMI Filter Arrays with ESD Diodes for Mobile Handsets - OnChip Devices, Inc. introduces a broad family of EMI Filter Arrays with Built-in ESD Diode Protection in miniature and low profile packages
OnChip Introduces Miniature EMI Filter Arrays with ESD Diodes for Mobile Handsets

 

PRZOOM - /newswire/ - Santa Clara, CA, United States, 2008/04/01 - OnChip Devices, Inc. introduces a broad family of EMI Filter Arrays with Built-in ESD Diode Protection in miniature and low profile packages.

   
 
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A global leader in Integrated Passives, OnChip Devices today introduced a family of electromagnetic interference (EMI) filter arrays with on-board electrostatic discharge (ESD) protection in various TDFN and uDFN package options. Specifically designed for high-speed data interfaces in mobile phones, this EMF110x family is offered in 4-channel, 6-channel and 8-channel filter arrays. They provide superior electrical performance and significant board space savings.

The EMF110x delivers excellent S21 characteristics with extremely low parasitic inductance (10 pH) due to the package ground pad. These devices are capable of attenuating unwanted signals over RF band between 800 MHz and 2.9 GHz. Additionally, the EMF110x provides ESD protection up to +/-15kV contact discharge per IEC61000-4-2 Level 4 specifications.

“While OnChip continues to set the space in the industry for new products, the introduction of the EMF110x clearly establishes us as a broad-based supplier of integrated passive devices,” said Ashok Chalaka, OnChip Devices’ President and CEO. “The primary applications for these new EMI filters are high resolution color displays and mega pixel camera interfaces in the next generation smaller and thinner cellular phones and PDAs.”

These packaged devices offer higher reliability with respect to handling and solderability compared to both Chip Scale Packages and discrete filters. Each EMF110x device features an application-specific cut-off frequency (105 MHz to 210 MHz) and is optimized for LCD displays and Camera interfaces. The TDFN package has a thickness of 0.75mm and is offered in both the 0.4mm and 0.5mm pad-pitch. The uDFN package has a thickness of 0.5mm and a pad-pitch of 0.4mm.

Availability and Pricing
The OnChip EMF1100, EMF1101, EMF1102 and EMF1103 products are available immediately worldwide. These devices have production pricing in the range of $0.09 to $0.21, depending on the package type and the number of filter channels. Developed at OnChip Devices’ Santa Clara facility, these components are produced to the highest quality standards.

About OnChip Devices
OnChip Devices (onchip.com) head-quartered in Santa Clara, CA is a global leader in Integrated Passive Devices. With it’s own silicon fabrication facility and strong partnerships with full turn-key assembly houses in Asia, OnChip is offering state-of-the-art silicon and ceramic solutions for High-brightness LED, Computing and Consumer Electronics.

 
 
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Agency / Source: OnChip Devices, Inc.

 
 

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OnChip Introduces Miniature EMI Filter Arrays with ESD Diodes for Mobile Handsets

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Contact: Ashok Chalaka - OnChip.com 
408-654-9365 x111 sales[.]onchip.com
 
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IMPORTANT INFORMATION: Issuance, publication or distribution of this press release in certain jurisdictions could be subject to restrictions. The recipient of this press release is responsible for using this press release and the information herein in accordance with the applicable rules and regulations in the particular jurisdiction. This press release does not constitute an offer or an offering to acquire or subscribe for any OnChip Devices, Inc. securities in any jurisdiction including any other companies listed or named in this release.

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