The market continues to witness a proliferation of automobile electronic content due to government pollution guidelines, safety and security regulations, and the ongoing oil crisis. This growing need directly influences the markets of automobile application specific integrated circuits (ASICs), application specific standard parts (ASSPs), and field programmable gate arrays (FPGAs).
New analysis from Frost & Sullivan (semiconductors.frost.com), World Automobile ASIC, ASSP, and FPGA Markets, reveals that the market earned revenues of $6.75 billion in 2006 and estimates this to reach $10.26 billion in 2010.
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“The automobile ASIC, ASSP, and FPGA markets have witnessed significant increases due to the growth of end-user markets and expanding applications of integrated circuits (ICs) in automobiles,” notes Frost & Sullivan Senior Research Analyst Bonnie Varghese K. “Moreover, the increasing luxury features in automobiles require very efficient solutions thereby boosting market demand.”
In addition, rising fuel prices in the world market, feed the demand for electric and hybrid vehicles, which in turn can boost the growth of electronics in automobiles.
Sales of ASICs, ASSPs, and FPGAs have also improved due to integrated solutions, which have enabled manufacturers to lower costs by reducing the number of micro-controllers in automobiles.
Mandatory government regulations to enforce safety and security have greatly contributed to the growth of this market. In Europe, regulations such as the electronic stability program (ESP), antilock braking system (ABS), and electronically controlled independent suspension will likely help generate substantial revenues.
In the Asian region, increasing sales of automobiles drives the growth of ASICs, ASSPs, and FPGAs markets. The Asian market also has the potential to become the key contributor to the overall automobile ASIC, ASSP, and FPGA revenues.
Since safety, security, engine control features, telematics, and driver information applications will likely advance in the future, the automobile ASIC, ASSP, and FPGA markets appear poised for significant growth.
However, there exists intense competition in the market, especially among well-established segments such as ASIC and ASSP. These products are characterized by higher non-recurring engineering (NRE) and take a longer time to market even though their unit and integration costs remain less than FPGAs.
Technological developments can help reduce the time to market and NRE cost in ASIC and ASSP. Similarly, developments in FPGAs can lower the unit and integration costs and improve performance.
“ASIC and ASSP segment participants can benefit by targeting growing and developing economies, such as Asia, where opportunities exist in the low cost and higher volume automobile applications,” suggests Varghese.
Chipmakers can further resist competition by creating an extensive portfolio of core designs, developing world-class electronic design automation (EDA) software tools, and proactively engaging with original equipment manufacturer (OEM) customers in accelerating the market share of programmable logic devices (PLDs).
World Automobile ASIC, ASSP, and FPGA Markets is part of the Semiconductors Growth Partnership Service program, which includes research services in the following markets: World Markets for Microcontrollers in Automotives, World Markets for Discretes Power Semiconductors in Automobiles, World Markets for ASICs in Automobiles, World Handset RF Semiconductor Market, and World Wafer Markets. All research services included in subscriptions provide detailed market opportunities and industry trends evaluated following extensive interviews with market participants. Interviews with the press are available.
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