Based on its recent analysis of the near-field optical sensors market, Frost & Sullivan recognizes Heptagon with the 2016 Global Frost & Sullivan Award for New Product Innovation. Heptagon has rapidly expanded its product portfolio over the last six months by introducing a significant number of innovative new products and solutions addressing the Interface of Things™ connecting people and products. The company has leveraged its proprietary, cutting-edge ‘wafer-level miniaturization’ technology to launch the game-changing near-field optical sensing module in early 2016. It has the distinction of being the thinnest sensor of only 350 microns and boasts low power consumption and reliable detection of skin in close proximity enabling new ways for people to interact with products in wearable applications such as augmented reality and virtual reality, mobile applications, or consumer electronics.
“We very much appreciate receiving the 2016 Frost & Sullivan Global Product Innovation Award which validates our technology foundation and Interface-of-Things™ product vision ”, says Dr. Erik H. Volkerink, Heptagon’s Chief Business Officer and Executive Vice President,“As the product innovation focus in IOT moves from simple internet connectivity to new and intuitive ways of interfacing with people, our technology to integrate and miniaturize complex hardware and software systems, including optics, enable breakthroughs and differentiation in many markets .”
As Heptagon deftly performs the tasks of both original equipment manufacturer (OEM) and systems integrator, it is able to cater to diverse industry verticals such as consumer electronics, automotive, medical equipment, home automation, and security. It has underlined its research and development (R&D) expertise by applying its wafer-level manufacturing processes in the following three areas: wafer-level optics to create nanometer optical structures, wafer-level stacking for reflowable pads, and wafer-level integration for stacked optics and filters.
“Heptagon has effectively leveraged its patented wafer-level miniaturization technology to reduce the form factor, lower the total system cost, and improve the aesthetics of mobile and wearable devices, while conforming to stringent quality standards,” said Frost & Sullivan Research Analyst Dr Rajender Thusu. “The high sensitivity in a 40 percent smaller package emphasizes the tremendous value proposition of its near-field optical sensing module.”
The near-field optical sensing module is only 350 microns thick and has a surface area of 2 mm2. Within this space, it accommodates a built-in illuminator, a light sensor and electronics, crosstalk prevention features, and a lens system. The ultra-thin design makes the module apt for integration with next-generation wearable devices, smartphones, ultra-thin notebooks, medical devices, and a host of other consumer device applications.
Heptagon has distinctly applied its cutting-edge system-in-a-package technology in its entire class of optical sensors including single and multipoint 3-D range sensors, camera modules, proximity sensors, and illuminators. Importantly, it is able to offer extremely competitive rates by achieving economies of scale; it recently crossed the production milestone of 2 billion unit shipped and last year expanded its manufacturing capacity to 1 billion units per year.
“In addition to ensuring price-performance parity, its wafer-level miniaturization technology simplified all design complexities that existed in conventional sensing modules,” noted Dr. Thusu. “Furthermore, Heptagon closely collaborates with customers to rightly define target specifications for light, sensing, and imaging solutions.”
Heptagon makes the most of design simulation and manufacturing of prototypes to help strengthen its technology through effective tolerance and sensitivity analysis. It also presents cross-disciplinary expertise and design, as well as application services to complement customer product development.
Overall, for breaking new ground with the exceptional near-field optical sensing module and novel packaging technology for next-generation ultra-small sensors, Heptagon richly deserves the 2016 Global Frost & Sullivan Award for New Product Innovation.
Each year, Frost & Sullivan presents this award to the company that has developed an innovative element in a product by leveraging leading-edge technologies. The award recognizes the value-added features/benefits of the product and the increased ROI it offers customers, which, in turn, increases customer acquisition and overall market penetration potential.
Frost & Sullivan Best Practices awards recognize companies in a variety of regional and global markets for demonstrating outstanding achievement and superior performance in areas such as leadership, technological innovation, customer service, and strategic product development. Industry analysts compare market participants and measure performance through in-depth interviews, analysis, and extensive secondary research to identify best practices in the industry.
Heptagon (hptg.com) provides complete 3D/imaging, illumination and optical sensing solutions for smart devices and the Interface of Things™. With over 2 billion units shipped and 20 years of industry firsts in miniaturizing and integrating complex hardware and software systems, Heptagon has industry leading technology and services to enhance our customer’s competitiveness. Backed by world-class investors, Heptagon is a global company with research and development, sales and customer services teams located in Singapore, Zurich Switzerland, in Silicon Valley USA, and Shenzhen China.
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Heptagon PR Contact: Scott Filler
P: +1 650-336-7990 - E: pr[.]hptg.com.