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Infineon Technologies AG Introduces The New TO-220 FullPAK Wide Creepage Package - Infineon Technologies AG introduced the TO-220 FullPAK Wide Creepage package - Infineon.com
Infineon Technologies AG Introduces The New TO-220 FullPAK Wide Creepage Package

 

PRZOOM - /newswire/ - Munich, Germany, 2016/04/26 - Infineon Technologies AG introduced the TO-220 FullPAK Wide Creepage package - Infineon.com. FSE: IFX; OTCQX: IFNNY

   
 
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The new package is offered for the 600 V CoolMOS™ CE, targeting a broad range of low power consumer applications. This package features an improved creepage and has been developed to meet the demanding requirements of open frame power supplies where pollution might lead to arcing failures of applications.

The TO-220 FullPAK Wide Creepage replaces frequently used workarounds to increase creepage distance such as silicon potting, the usage of sleeves, pre-bending of leads or others. Offering a better alternative to workarounds, customers profit from reduced system costs when implementing the new package.

Wide spread pins prevent failures

The TO-220 FullPAK Wide Creepage package targets open frame power supplies such as TV adapters where dust can enter the case through air vents. These dust particles can reduce the effective creepage between pins over time which may lead to high voltage arcing. The new TO-220 FullPAK Wide Creepage package comes with a pin distance of 4.25 mm instead of the prevailing 2.54 mm found in a standard TO-220 FullPAK package.

The other outer dimensions of the new package are almost identical to the TO-220 FullPAK. Additionally, the new Wide Creepage package shows all the well-known benefits of a standard FullPAK, predominantly its excellent isolation behavior as well as the assembly automation ability.

Availability

The TO-220 FullPAK Wide Creepage package is available now. For further information: infineon.com/TO220-FP-widecreepage.

Information Number: INFPMM201604-049

 
 
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Infineon Technologies AG Introduces The New TO-220 FullPAK Wide Creepage Package

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TO-220 FullPAK | Infineon Technologies AG
Contact: Fabian Schiffer - Infineon.com 
+49 89 23425869 fabian.schiffer[.]infineon.com
 
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IMPORTANT INFORMATION: Issuance, publication or distribution of this press release in certain jurisdictions could be subject to restrictions. The recipient of this press release is responsible for using this press release and the information herein in accordance with the applicable rules and regulations in the particular jurisdiction. This press release does not constitute an offer or an offering to acquire or subscribe for any Infineon Technologies AG securities in any jurisdiction including any other companies listed or named in this release.

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