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IGBT and Diode Function on Single Chip Deliver Enhanced Reliability for High-Performance Applications such as Traction and Industrial Drives - Infineon Technologies AG has launched a 6.5 kV power module that features IGBT and freewheeling diode functionality integrated into a single chip - Infineon.com
IGBT and Diode Function on Single Chip Deliver Enhanced Reliability for High-Performance Applications such as Traction and Industrial Drives

 

PRZOOM - /newswire/ - Munich, Germany, 2015/06/22 - Infineon Technologies AG has launched a 6.5 kV power module that features IGBT and freewheeling diode functionality integrated into a single chip - Infineon.com. FSE: IFX; OTCQX: IFNNY

   
 
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This new RCDC (Reverse Conducting IGBT with Diode Control) chip is ideal for modern high-speed trains and high-performance locomotives as well as for future HVDC electric power transmission systems and medium voltage drives used for example in oil, gas and mining industries. Compared to previous modules with the same footprint, the RCDC technology delivers a 33 percent increase in current density and improved thermal performance. Thus it supports longer lifecycles and enhanced reliability, ultimately minimizing maintenance.

With the RCDC technology Infineon extends its high-performance 6.5kV KE3 portfolio of IGBTs. The increased current density is a result of more active silicon area in both forward and reverse current direction giving designers the flexibility to increase system output power without incurring space penalties. Alternatively, the benefits of increased power density can be used to maintain power while reducing the number of IGBTs and, therefore, system size, weight and cost.

Infineon’s RCDC solution is supplied in an IHV-A high isolation package with an industry-standard footprint, supporting ‘drop-in’ replacement for existing applications. As well as facilitating higher power densities, the monolithic integration of IGBT and diode results in a significant improvement in the diode I 2t value and the IGBT and diode thermal impedance (R th/Z th). The latter ensures good thermal performance over the full range of operation. A lower virtual junction temperature (T vj) ripple supports extended lifetime operation, while the option to use gate control allows designers to optimize overall efficiency by trading off conduction and switching losses.

Availability
Engineering samples of the RCDC modules are available now, with starter kits including driver evaluation board scheduled for Q4 2015. To simplify and speed implementation Infineon is offering a variety of design-in support options including application notes and control concepts.

About Infineon
Infineon Technologies AG (infineon.com) is a world leader in semiconductors. Infineon offers products and system solutions addressing three central challenges to modern society: energy efficiency, mobility, and security. In the 2014 fiscal year (ending September 30), the company reported sales of Euro 4.3 billion with about 29,800 employees worldwide. In January 2015, Infineon acquired US-based International Rectifier Corporation, a leading provider of power management technology, with revenues of USD 1.1 billion (fiscal year 2014 ending June 29) and approximately 4,200 employees.

Information Number: INFIPC201506.063

 
 
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IGBT and Diode Function on Single Chip Deliver Enhanced Reliability for High-Performance Applications such as Traction and Industrial Drives

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RCDC Technology | Infineon Technologies AG
Contact: Fabian Schiffer - Infineon.com 
+49 89 23425869 fabian.schiffer[.]infineon.com
 
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IMPORTANT INFORMATION: Issuance, publication or distribution of this press release in certain jurisdictions could be subject to restrictions. The recipient of this press release is responsible for using this press release and the information herein in accordance with the applicable rules and regulations in the particular jurisdiction. This press release does not constitute an offer or an offering to acquire or subscribe for any Infineon Technologies AG securities in any jurisdiction including any other companies listed or named in this release.

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