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Ashburn, VA, United States, 2014/12/17 - Conduction-Cooled (L200 Level ruggedization) 6U Carrier Eases Integration of XMC Mezzanine Cards into Embedded Systems for Defense & Aerospace Applications - CurtissWright.com. NYSE: CW
Curtiss-Wright Corporation today announced that its Defense Solutions division is now shipping its recently announced VPX6-218 rugged 6U OpenVPX™ XMC carrier card. The new conduction-cooled module enables system designers to quickly and easily add up to two (2) XMC (VITA 42.3) mezzanine module cards to their OpenVPX-based embedded systems. The deployment-ready carrier card is ruggedized to L200 conduction-cooled and is qualified for operation with a card edge temperature ranging from -40C to +85C. The VPX6-218 is ideal for use with today’s high performance FPGA mezzanine modules. Each of its two XMC sites provides power and thermal management for up to 25 Watts. The carrier can be optionally configured with a processor mezzanine module such as Curtiss-Wright’s XMC-109. The processor mezzanine module is able to fully function as a system master, providing system integrators with a flexible approach for designing a 6U single board computer (SBC). The VPX6-218 also supports 8-lanes of PCIe Gen2 to provide system integrators with the flexibility to expand their system architecture with the exact I/O required by their application. The new carrier enables system designers to speed the integration of high-end XMC-based devices into VPX system designs. It is ideal for use in deployed applications intended for harsh defense and aerospace environments, including ground combat vehicles, and manned and unmanned airborne platforms.
“We are pleased to announce that we are now in production and shipping our highly reliable and SWaP-C optimized VPX6-218 XMC Card Carrier,” said Lynn Bamford, Senior Vice President and General Manager, Defense Solutions division. “The rugged module’s reduced component count ‘XMC-only’ architecture boosts system MTBF and reduces power dissipation while optimizing the thermal performance of its dual XMC sites.”
About the VPX6-218
The VPX6-218 features a high speed, low latency PCIe interface that communicates with the host processor over the VPX backplane. It can host two 25W XMCs and is designed to support today’s high performance mezzanine modules, such as the Curtiss-Wright XF07-523 FPGA XMC, that require more power than typical I/O modules. This fully OpenVPX-compliant carrier card provides a lower power, reduced cost, and higher reliability alternative to its predecessor, the VPX6-215.
Curtiss-Wright End-to-End System Solutions
The new carrier complements a wide range of Curtiss-Wright COTS solutions for defense and aerospace, including our VPX6-1957 and VPX6-1958 Intel® Core® i7-based Single Board Computers and our CHAMP-AV8 and CHAMP-AV9 Digital Signal Processors (DSPs). Curtiss-Wright COTS solutions, which include modules available in VPX and XMC mezzanine form factors and a complete family of fully integrated subsystems, are designed for immediate deployment, delivering optimal performance in the most rugged environments.
Sales inquiries: Please forward all Sales and reader service inquiries to Kavita Williams, Curtiss-Wright Defense Solutions, T: 661-705-1142 / F: 661-705-1206 - E: ds[.]curtisswright.com.
About Curtiss-Wright Corporation
Curtiss-Wright Corporation (curtisswright.com | cwcdefense.com) is a global innovative company that delivers highly engineered, critical function products and services to the commercial, industrial, defense and energy markets. Building on the heritage of Glenn Curtiss and the Wright brothers, Curtiss-Wright has a long tradition of providing reliable solutions through trusted customer relationships. The company employs approximately 10,000 people worldwide.
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