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Largest Available Memory and Fast Processing Infineon Presents New Security Chip with Integrity Guard for Electronic Passports - Security chip makes electronic ID documents future proof and border controls more efficient; Infineon is awarded the Sesames 2013 for the fastest electronic passport [FSE: IFX / OTCQX: IFNNY] - Infineon.com
Largest Available Memory and Fast Processing Infineon Presents New Security Chip with Integrity Guard for Electronic Passports

 

PRZOOM - /newswire/ - Neubiberg, Germany, 2013/11/19 - Security chip makes electronic ID documents future proof and border controls more efficient; Infineon is awarded the Sesames 2013 for the fastest electronic passport [FSE: IFX / OTCQX: IFNNY] - Infineon.com. FSE: IFX; OTCQX: IFNNY

   
 
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Infineon Technologies AG today introduced a new security controller for electronic passports (ePassports), featuring the industry’s highest memory density and data transfer rate. The new SLE78 with ‘Integrity Guard’ technology offers more than three times memory space for secure storage of personal and biometric data as well as for electronic visas or entry and exit stamps, which will also require on-chip storage in future ePassports. To be able to process immigration security checks as efficiently as possible despite the increased amount of data, the new security controller enables eight times faster contactless read time by electronic readers. To the benefit of both travelers and airport operators, passport data can be read on average in less than one second by contactless readers at electronic checkpoints in airports.

At the CARTES 2013 Secure Connexions Event, in Paris from November 19-21, Infineon is showcasing the world’s fastest ePassport which implements the state-of-the-art SAC (Supplemental Access Control) mechanism required in next generation ePassports. Yesterday this fastest ePassport chip technology was awarded the Sesames 2013 for the best product in the ID and health card category. An international jury of independent experts in the chip-card industry selected the winners in ten separate categories from a field of 319 applicants and 34 finalists.

“With 3-times greater storage density and 8-times faster data-transmission speed compared to alternatives, the SLE78 with Integrity Guard is best prepared for future generations of e-passport,” says Carsten Loschinsky, Head of the Government ID business line at Infineon Technologies. “Infineon security controllers with Integrity Guard are established as the leading solution on the market for electronic documents with long-term validity such as passports and identity cards. We are now further extending our lead.”

SOLID FLASH™ technology perfect match for future ePassport generations
To comply with the ICAO (International Civil Aviation Organization) LDS 2.0 Standard, electronic passports issued in the medium term will be required to store a larger amount of data than they do today. As a result, security controller requirements in terms of memory capacity and processing speed are dramatically increasing.

With its SOLID FLASH technology, Infineon is once again setting new standards and enables large memory density in an extremely small space. The new security chip offers the industry’s highest memory density of 700 kBytes. In addition to the approximately 200 kBytes of space required for program code, the new SLE78 offers up to 500 kBytes of flash-based memory capacity for variable data. In addition to the card holders’ personal and biometric data, the SLE78 also can store securely a great number of electronic visas, hundreds of electronic entry and exit stamps and even loyalty points for frequent traveler programs. Comparatively, alternative solutions based on ROM technology only provide a capacity of 144 kBytes. Since a major part of the 144 kBytes is used to store passport data such as nationality, issue date, etc., ROM-technology soon reaches its limit when complied with the demands placed on new generations of electronic passports.

To process large amounts of data as quickly as possible at border controls, the new SLE78 security controller uses the VHBR (Very-High-Bit-Rate) protocol compliant to ISO/IEC 14443 with a 6.8 Mbit/s data rate. In addition, the VHBR protocol improves the stability of contactless communication between the electronic passport and the corresponding reader.

Thanks to Infineon’s ‘Integrity Guard’ digital security technology, the chip is perfectly suited to meet the growing security requirements of electronic identification documents. With Integrity Guard, data are not only stored in completely encrypted form but are also processed in encrypted form by two mutually monitoring CPUs.

Availability
The 16-bit security controller is available in various versions: as chip with a contactless interface or as dual-interface chip (SLE78CLFX500VPH) that combines both a contact-based as well as a contactless interface to enable a smooth transition from today’s technologies into the contactless world of tomorrow.

Security for the connected world
For more information about chip cards and security solutions at Infineon, please visit infineon.com/chip-card-and-security.

About Infineon
Infineon Technologies AG (infineon.com), Neubiberg, Germany, offers semiconductor and system solutions addressing three central challenges to modern society: energy efficiency, mobility, and security. In the 2013 fiscal year (ending September 30), the Company reported sales of €3.84 billion with around 26,700 employees worldwide. Infineon is listed on the Frankfurt Stock Exchange (ticker symbol: IFX) and in the USA on the over-the-counter market OTCQX International Premier (ticker symbol: IFNNY).

Information Number: INFCCS201311.007

 
 
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Agency / Source: Infineon Technologies AG

 
 

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Largest Available Memory and Fast Processing Infineon Presents New Security Chip with Integrity Guard for Electronic Passports

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ePassport | Infineon Technologies AG
Contact: Karin Braeckle - Infineon.com 
+49 89 23423424 karin.braeckle[.]infineon.com
 
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IMPORTANT INFORMATION: Issuance, publication or distribution of this press release in certain jurisdictions could be subject to restrictions. The recipient of this press release is responsible for using this press release and the information herein in accordance with the applicable rules and regulations in the particular jurisdiction. This press release does not constitute an offer or an offering to acquire or subscribe for any Infineon Technologies AG securities in any jurisdiction including any other companies listed or named in this release.

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