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Dow Corning Joins imec to Advance Enabling Technologies for 3D IC Semiconductor Packaging - Dow Corning, a global leader in silicones, silicon-based technology and innovation, announced that it is among the newest member organizations to join imec, a leading research center for the advancement of nano-electronics - DowCorning.com / imec.be
Dow Corning Joins imec to Advance Enabling Technologies for 3D IC Semiconductor Packaging

 

PRZOOM - /newswire/ - San Francisco, CA, United States, 2013/07/08 - Dow Corning, a global leader in silicones, silicon-based technology and innovation, announced that it is among the newest member organizations to join imec, a leading research center for the advancement of nano-electronics - DowCorning.com / imec.be.

   
 
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The announcement signals expanded opportunities for both organizations to combine their expertise toward the development and broader adoption of 3D integrated circuit (IC) packaging technologies, wherein IC chips are stacked in vertical 3D architectures.

“This move is a natural and strategic step for Dow Corning and imec, as we both believe collaborative innovation is as critical to industry leadership as native expertise,” said Andrew Ho, global industry director, Advanced Semiconductor Materials at Dow Corning. “Our access to imec’s world-class resources and expertise will not only help us further refine our unique temporary bonding solution, it will allow imec to leverage that solution to advance integration of the 3D IC packaging process that they’ve been developing for years.”

By integrating multiple chips into a single package, 3D IC technology promises to reduce form factor and power consumption, and increase bandwidth to enable more efficient inter-chip communication for next-generation microelectronics devices. Yet, before 3D IC fabrication can see broader adoption, it will require innovative advances in materials and processing technologies.

One of the key challenges imec is tackling is the bonding of the device wafer to a carrier wafer, prior to wafer thinning, and the safe debonding of the thin wafer after completion of backside processing. This was Dow Corning’s goal when designing its Temporary Bonding Solution, aims at simple processing using a bi-layer concept comprising an adhesive and release layer. The technology also enables room-temperature bonding and debonding processes based on standard manufacturing methods.

Together with imec, Dow Corning will explore its temporary bonding CMOS-compatible solution for 3D Through-Silicon-Via (TSV) semiconductor packaging. The collaboration will aim to further expand the technology’s ability to achieve simple, cost-effective bonding-debonding techniques compatible with standard manufacturing processes.

“Imec’s precompetitive programs are an essential platform for industry leaders to share the risk and cost of advanced research. As one of the semiconductor industry’s most proven pioneers in advanced silicone-based solutions, Dow Corning brings valuable materials and processing expertise to imec’s global network of innovators as well as a key enabling technology for TSV fabrication,” said Eric Beyne, program director 3D System Integration at imec. “We look forward to collaborating closely with our newest member organization as we drive the next stage of 3D integration, and help ensure compatiblity of the proposed thin wafer carrier solution with advanced, sub-10-nanometer CMOS device technologies.”

To learn more about Dow Corning’s advanced silicone technologies for advanced semiconductor manufacturing and other applications, please visit dowcorning.com/electronics.

Imec exhibits at SEMICON West, July 9-11, 2013. Visit our booth 1741, South hall.

About imec
Imec (imec.be) performs world-leading research in nanoelectronics. Imec leverages its scientific knowledge with the innovative power of its global partnerships in ICT, healthcare and energy. Imec delivers industry-relevant technology solutions. In a unique high-tech environment, its international top talent is committed to providing the building blocks for a better life in a sustainable society. Imec is headquartered in Leuven, Belgium, and has offices in Belgium, the Netherlands, Taiwan, US, China, India and Japan. Its staff of more than 2,000 people includes more than 650 industrial residents and guest researchers. In 2012, imec's revenue (P&L) totaled 320 million euro.

Imec is a registered trademark for the activities of IMEC International (a legal entity set up under Belgian law as a "stichting van openbaar nut”), imec Belgium (IMEC vzw supported by the Flemish Government), imec the Netherlands (Stichting IMEC Nederland, part of Holst Centre which is supported by the Dutch Government), imec Taiwan (IMEC Taiwan Co.) and imec China (IMEC Microelectronics (Shangai) Co. Ltd.) and imec India (Imec India Private Limited).

About Dow Corning
Dow Corning (dowcorning.com) provides performance-enhancing solutions to serve the diverse needs of more than 25,000 customers worldwide. A global leader in silicones, silicon-based technology and innovation, Dow Corning offers more than 7,000 products and services via the company’s Dow Corning® and XIAMETER® brands. Dow Corning is equally owned by The Dow Chemical Company and Corning, Incorporated. More than half of Dow Corning’s annual sales are outside the United States. Dow Corning’s global operations adhere to the American Chemistry Council’s Responsible Care® initiative, a stringent set of standards designed to advance the safe and secure management of chemical products and processes.

® Dow Corning and XIAMETER registered trademarks of Dow Corning Corporation.
® Responsible Care is a registered service mark of the American Chemistry Council, Inc.

Contact Dow Corning:
Mirella Kimpen - Dow Corning Electronics Solutions
T: +32 64 888 413

Aaron Wood - AH&M Marketing Communications
T: +1 413 448 2260 x470 / E: awood[.]ahminc.com.

 
 
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Dow Corning Joins imec to Advance Enabling Technologies for 3D IC Semiconductor Packaging

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Contact: Katrien Marent - imec.be 
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IMPORTANT INFORMATION: Issuance, publication or distribution of this press release in certain jurisdictions could be subject to restrictions. The recipient of this press release is responsible for using this press release and the information herein in accordance with the applicable rules and regulations in the particular jurisdiction. This press release does not constitute an offer or an offering to acquire or subscribe for any Imec securities in any jurisdiction including any other companies listed or named in this release.

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